Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854920 | Embedded chip package and manufacturing method thereof | Xianming Chen, Jindong FENG, Lei Feng, Wenshi Wang | 2023-12-26 |
| 11822121 | Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof | Xianming Chen, Lei Feng, Wenshi Wang, Lina JIANG | 2023-11-21 |
| 11769733 | Package substrate | Xianming Chen, Yejie HONG, Lei Feng | 2023-09-26 |
| 11682621 | Connector for implementing multi-faceted interconnection | Xianming Chen, Lei Feng, Yejie HONG | 2023-06-20 |
| 11579362 | Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof | Xianming Chen, Lei Feng, Wenshi Wang, Lina JIANG | 2023-02-14 |
| 11569177 | Support frame structure and manufacturing method thereof | Xianming Chen, Jindong FENG, Lei Feng, Jiangjiang ZHAO, Wenshi Wang | 2023-01-31 |