Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854920 | Embedded chip package and manufacturing method thereof | Xianming Chen, Benxia HUANG, Lei Feng, Wenshi Wang | 2023-12-26 |
| 11569177 | Support frame structure and manufacturing method thereof | Xianming Chen, Benxia HUANG, Lei Feng, Jiangjiang ZHAO, Wenshi Wang | 2023-01-31 |