Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769733 | Package substrate | Xianming Chen, Benxia HUANG, Lei Feng | 2023-09-26 |
| 11682621 | Connector for implementing multi-faceted interconnection | Xianming Chen, Lei Feng, Benxia HUANG | 2023-06-20 |