Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776879 | Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereof | Guandong Liu, Shunbin Li, Ruyun Zhang | 2023-10-03 |
| 11648015 | Waterjet cutting system | Zhiyong Xu, Zixin Li | 2023-05-16 |