Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776879 | Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereof | Guandong Liu, Weihao Wang, Ruyun Zhang | 2023-10-03 |
| 11705437 | Interconnection structure of system on wafer and PCB base on TSV process and method for manufacturing the same | Qingwen Deng, Kun Zhang, Ruyun Zhang | 2023-07-18 |