Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11789639 | Method and apparatus for screening TB-scale incremental data | Hong Zhang, Yuan Liang, Tao Zou | 2023-10-17 |
| 11776879 | Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereof | Guandong Liu, Weihao Wang, Shunbin Li | 2023-10-03 |
| 11705437 | Interconnection structure of system on wafer and PCB base on TSV process and method for manufacturing the same | Qingwen Deng, Kun Zhang, Shunbin Li | 2023-07-18 |