Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11758732 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2023-09-12 |
| 11749641 | Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same | Jun Liu | 2023-09-05 |
| 11721668 | Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same | Jun Liu | 2023-08-08 |
| 11711913 | Bonded semiconductor devices having programmable logic device and NAND flash memory and methods for forming the same | Jun Liu | 2023-07-25 |
| 11694993 | Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same | Jun Liu | 2023-07-04 |
| 11631688 | Bonded unified semiconductor chips and fabrication and operation methods thereof | Jun Liu | 2023-04-18 |
| 11562985 | Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same | Jun Liu | 2023-01-24 |