| 11844216 |
Three-dimensional memory devices and fabricating methods thereof |
Li Xiao |
2023-12-12 |
| 11808975 |
Semiconductor structure and fabrication method thereof |
Hong Dai, Dong Xiang Cheng |
2023-11-07 |
| 11798914 |
Methods and structures for die-to-die bonding |
— |
2023-10-24 |
| 11765898 |
Stacked connections in 3D memory and methods of making the same |
Zongliang Huo |
2023-09-19 |
| 11763885 |
Variable resistance memory with lattice array using enclosing transistors |
— |
2023-09-19 |
| 11749641 |
Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same |
Weihua Cheng |
2023-09-05 |
| 11728236 |
Three-dimensional memory devices having hydrogen blocking layer and fabrication methods thereof |
— |
2023-08-15 |
| 11729978 |
Channel hole and bitline architecture and method to improve page or block size and performance of 3D NAND |
— |
2023-08-15 |
| 11721668 |
Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same |
Weihua Cheng |
2023-08-08 |
| 11711913 |
Bonded semiconductor devices having programmable logic device and NAND flash memory and methods for forming the same |
Weihua Cheng |
2023-07-25 |
| 11706920 |
Three-dimensional memory devices and fabrication methods thereof |
Li Xiao |
2023-07-18 |
| 11694993 |
Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same |
Weihua Cheng |
2023-07-04 |
| 11659702 |
Bonded semiconductor devices having processor and static random-access memory and methods for forming the same |
— |
2023-05-23 |
| 11652481 |
Designing single event upset latches |
Pierre Maillard, Betty LAU, Yanran Chen, Martin L. Voogel |
2023-05-16 |
| D985182 |
Ring unit for flashlight |
Wei Xiong |
2023-05-02 |
| 11631688 |
Bonded unified semiconductor chips and fabrication and operation methods thereof |
Weihua Cheng |
2023-04-18 |
| 11621414 |
Lithium metal pouch cells and methods of making the same |
Jie Xiao, Hongkyung Lee, Dianying Liu, Chaojiang Niu |
2023-04-04 |
| 11605593 |
Semiconductor devices having interposer structure with adhesive polymer and methods for forming the same |
— |
2023-03-14 |
| 11600637 |
Stacked connections in 3D memory and methods of making the same |
Zongliang Huo |
2023-03-07 |
| 11600636 |
Stacked connections in 3D memory and methods of making the same |
Zongliang Huo |
2023-03-07 |
| 11594461 |
Three-dimensional memory devices having hydrogen blocking layer and fabrication methods thereof |
— |
2023-02-28 |
| 11562985 |
Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same |
Weihua Cheng |
2023-01-24 |
| 11552056 |
Three-dimensional memory device with three-dimensional phase-change memory |
— |
2023-01-10 |
| 11551753 |
Three-dimensional memory device with embedded dynamic random-access memory |
— |
2023-01-10 |