Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837591 | Manufacturing method of light emitting diode package structure | Ming-Ru Chen, Tzyy-Jang Tseng | 2023-12-05 |
| 11715715 | Metal bump structure and manufacturing method thereof and driving substrate | Tzyy-Jang Tseng, Ming-Ru Chen, Chin-Sheng Wang, Wen-Sen Tang | 2023-08-01 |