Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715715 | Metal bump structure and manufacturing method thereof and driving substrate | Tzyy-Jang Tseng, Ming-Ru Chen, Cheng-Chung Lo, Chin-Sheng Wang | 2023-08-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715715 | Metal bump structure and manufacturing method thereof and driving substrate | Tzyy-Jang Tseng, Ming-Ru Chen, Cheng-Chung Lo, Chin-Sheng Wang | 2023-08-01 |