Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715715 | Metal bump structure and manufacturing method thereof and driving substrate | Tzyy-Jang Tseng, Ming-Ru Chen, Cheng-Chung Lo, Wen-Sen Tang | 2023-08-01 |
| 11690173 | Circuit board structure | Tzyy-Jang Tseng, Ra-Min Tain | 2023-06-27 |