Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11800642 | Bonding pad structure for electronic device and manufacturing method thereof | Xian Bin Xu, He Luo, Ming-Qiang Fu, Chen-Hsin Chang | 2023-10-24 |
| 11650704 | Bonding structure and electronic device | Xian Bin Xu, Bao Huang Chen, Qing Hui Lu, Chen-Hsin Chang, Po-Pin Hung | 2023-05-16 |