Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11800642 | Bonding pad structure for electronic device and manufacturing method thereof | Xian Bin Xu, He Luo, Xiong Zhang, Chen-Hsin Chang | 2023-10-24 |
| 11647645 | Cover plate used in electronic device, electronic device, and method of manufacturing cover plate | Chun-Yan Wu, Lien-Hsin Lee, Shi Yuan Lian, Xian Bin Xu, Ming-Hsien Ko | 2023-05-09 |