Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11800642 | Bonding pad structure for electronic device and manufacturing method thereof | Xian Bin Xu, Ming-Qiang Fu, Xiong Zhang, Chen-Hsin Chang | 2023-10-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11800642 | Bonding pad structure for electronic device and manufacturing method thereof | Xian Bin Xu, Ming-Qiang Fu, Xiong Zhang, Chen-Hsin Chang | 2023-10-24 |