Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637083 | Flip-chip package assembly | Rafael Jose Lizares Guevara, John Carlo Cruz Molina | 2023-04-25 |
| 11600498 | Semiconductor package with flip chip solder joint capsules | James Raymond Maliclic Baello | 2023-03-07 |