Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699639 | Conductive member cavities | Jovenic Romero Esquejo, Arvin Cedric Quiambao Mallari | 2023-07-11 |
| 11637083 | Flip-chip package assembly | John Carlo Cruz Molina, Steffany Ann Lacierda Moreno | 2023-04-25 |
| 11600583 | Textured bond pads | Aniceto Tabangcura Rabilas, Jr., Ray Fredric De Asis, Sylvester Tigno Sanchez, Alvin Lopez Andaya | 2023-03-07 |