Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742266 | Electronic device topside cooling | Laura May Antoinette Dela Paz Clemente | 2023-08-29 |
| 11600498 | Semiconductor package with flip chip solder joint capsules | Steffany Ann Lacierda Moreno | 2023-03-07 |