Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848244 | Leaded wafer chip scale packages | Makoto Shibuya, Kengo Aoya | 2023-12-19 |
| 11736085 | Metal ribs in electromechanical devices | Anindya Poddar, Hau Nguyen | 2023-08-22 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848244 | Leaded wafer chip scale packages | Makoto Shibuya, Kengo Aoya | 2023-12-19 |
| 11736085 | Metal ribs in electromechanical devices | Anindya Poddar, Hau Nguyen | 2023-08-22 |