Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848244 | Leaded wafer chip scale packages | Masamitsu Matsuura, Kengo Aoya | 2023-12-19 |
| 11842952 | Double side heat dissipation for silicon chip package | — | 2023-12-12 |
| 11764142 | Semiconductor apparatus and method having a lead frame with floating leads | — | 2023-09-19 |
| 11725864 | Refrigerator | Kentaro Kan, Hiroshi Nakamura, Manabu Kikuchi, Ryota Aoki, Tomohiko Matsuno | 2023-08-15 |
| 11656021 | Refrigerator | Kentaro Kan, Manabu Kikuchi, Tomohiko Matsuno | 2023-05-23 |
| 11601065 | Power converter module | Woochan Kim, Vivek Kishorechand Arora, Kengo Aoya | 2023-03-07 |
| 11574855 | Package with dies mounted on opposing surfaces of a leadframe | Noboru Nakanishi | 2023-02-07 |