Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848244 | Leaded wafer chip scale packages | Makoto Shibuya, Masamitsu Matsuura | 2023-12-19 |
| 11601065 | Power converter module | Woochan Kim, Vivek Kishorechand Arora, Makoto Shibuya | 2023-03-07 |