Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791232 | Packaging structure and packaging method of digital circuit | Bo Peng, Ling Gao, Xiaojun Zhang, Yang Liu, Qiang-Fei Duan +1 more | 2023-10-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791232 | Packaging structure and packaging method of digital circuit | Bo Peng, Ling Gao, Xiaojun Zhang, Yang Liu, Qiang-Fei Duan +1 more | 2023-10-17 |