QD

Qiang-Fei Duan

📍 Hexi District, CN: #7 of 20 inventorsTop 35%
Overall (2023): #291,525 of 537,848Top 55%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11791232 Packaging structure and packaging method of digital circuit Bo Peng, Ling Gao, Xiaojun Zhang, Yang Liu, Dapeng Bi +1 more 2023-10-17