Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791232 | Packaging structure and packaging method of digital circuit | Bo Peng, Ling Gao, Yang Liu, Qiang-Fei Duan, Dapeng Bi +1 more | 2023-10-17 |
| 11626129 | Plating based side shield define and application in magnetic head | Jinqiu Zhang, Ming Sun, Feng Liu | 2023-04-11 |