Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810919 | Semiconductor device structure with conductive via structure and method for forming the same | Jyun-De Wu, Te-Chih Hsiung, Yi-Chen Wang, Yuan-Tien Tu, Peng Wang +1 more | 2023-11-07 |
| 11749732 | Etch profile control of via opening | Te-Chih Hsiung, Yi-Chen Wang, Yuan-Tien Tu, Huan-Just Lin, Jyun-De Wu | 2023-09-05 |
| 11664272 | Etch profile control of gate contact opening | Te-Chih Hsiung, Jyun-De Wu, Yi-Chen Wang, Yuan-Tien Tu, Huan-Just Lin | 2023-05-30 |
| 11566422 | Structural joint and sealing element for panels | Chian-Chi Huang, Tzu-Wei Liu, Jui-Ping Chen, Yu-Ying Yai, Yu-Tung Hsing +3 more | 2023-01-31 |