Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810919 | Semiconductor device structure with conductive via structure and method for forming the same | Jyun-De Wu, Yi-Chun Chang, Yi-Chen Wang, Yuan-Tien Tu, Peng Wang +1 more | 2023-11-07 |
| 11749732 | Etch profile control of via opening | Yi-Chun Chang, Yi-Chen Wang, Yuan-Tien Tu, Huan-Just Lin, Jyun-De Wu | 2023-09-05 |
| 11728212 | Integrated circuit structure and manufacturing method thereof | Jyun-De Wu, Peng Wang, Huan-Just Lin | 2023-08-15 |
| 11705491 | Etch profile control of gate contact opening | Peng Wang, Huan-Just Lin, Jyun-De Wu | 2023-07-18 |
| 11664272 | Etch profile control of gate contact opening | Yi-Chun Chang, Jyun-De Wu, Yi-Chen Wang, Yuan-Tien Tu, Huan-Just Lin | 2023-05-30 |
| 11581218 | Etch profile control of gate contact opening | Jyun-De Wu, Peng Wang, Huan-Just Lin | 2023-02-14 |