Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810919 | Semiconductor device structure with conductive via structure and method for forming the same | Te-Chih Hsiung, Yi-Chun Chang, Yi-Chen Wang, Yuan-Tien Tu, Peng Wang +1 more | 2023-11-07 |
| 11769857 | Micro light-emitting device | Yen-Chun Tseng, Tzu-Yang Lin, Yi-Chun Shih | 2023-09-26 |
| 11749732 | Etch profile control of via opening | Te-Chih Hsiung, Yi-Chun Chang, Yi-Chen Wang, Yuan-Tien Tu, Huan-Just Lin | 2023-09-05 |
| 11728212 | Integrated circuit structure and manufacturing method thereof | Te-Chih Hsiung, Peng Wang, Huan-Just Lin | 2023-08-15 |
| 11705491 | Etch profile control of gate contact opening | Te-Chih Hsiung, Peng Wang, Huan-Just Lin | 2023-07-18 |
| 11664272 | Etch profile control of gate contact opening | Te-Chih Hsiung, Yi-Chun Chang, Yi-Chen Wang, Yuan-Tien Tu, Huan-Just Lin | 2023-05-30 |
| 11658268 | Light-emitting semiconductor structure and light-emitting semiconductor substrate | Hsin-Chiao Fang, Yen-Lin Lai | 2023-05-23 |
| 11581218 | Etch profile control of gate contact opening | Te-Chih Hsiung, Peng Wang, Huan-Just Lin | 2023-02-14 |
| 11567124 | Wafter, wafer testing system, and method thereof | Yen-Lin Lai, Chi-Heng Chen | 2023-01-31 |
| 11542604 | Heating apparatus and chemical vapor deposition system | Yen-Lin Lai, Chi-Heng Chen | 2023-01-03 |