Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735921 | Method for flattening impedance of power delivery network by means of selecting decoupling capacitor | Ding-Bing Lin, Jhih-Yu Yu | 2023-08-22 |
| 11626293 | Method of manufacturing a semiconductor device | Wei-Han Lai, Ching-Yu Chang, Chin-Hsiang Lin | 2023-04-11 |