Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11851224 | Integrated semiconductor die parceling platforms | Hsu-Shui Liu, Jiun-Rong Pai, Yang-Ann Chu, Chieh-Chun Lin, Shine CHEN | 2023-12-26 |
| 11820607 | Systems and methods for die transfer | Chih-Hung Huang, Yi-Fam Shiu, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai | 2023-11-21 |
| 11784073 | Apparatus and method for handling wafer carrier doors | Yang-Ann Chu, Alan Yang, Vic Huang, Hsu-Shui Liu, Jiun-Rong Pai | 2023-10-10 |
| 11721572 | Integrated semiconductor die vessel processing workstations | Guan-Wei Huang, Chih-Hung Huang, Yang-Ann Chu, Hsu-Shui Liu, Jiun-Rong Pai | 2023-08-08 |
| 11705358 | Systems and methods for automated processing ports | Yi-Fam Shiu, Eason Chen, Yang-Ann Chu, Jiun-Rong Pai | 2023-07-18 |
| 11699619 | Automated transfer and drying tool for process chamber | Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Yang-Ann Chu | 2023-07-11 |
| 11682571 | Apparatus and methods for handling die carriers | Kai-Chieh HUANG, Wei-Ting Hsiao, Yang-Ann Chu, I-Lun Yang, Hsuan Lee | 2023-06-20 |