Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11851224 | Integrated semiconductor die parceling platforms | Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Yang-Ann Chu, Chieh-Chun Lin | 2023-12-26 |
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Patents 2023