Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11820607 | Systems and methods for die transfer | Tsung-Sheng Kuo, Chih-Hung Huang, Yi-Fam Shiu, Hsuan Lee, Jiun-Rong Pai | 2023-11-21 |
CW
Chueng-Jen Wang
Overall (2023): #483,257 of 537,848Top 90%
1
Patents 2023