MY

Ming-Hsien Yang

TSMC: 1 patents #2,163 of 4,064Top 55%
Overall (2023): #319,357 of 537,848Top 60%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11791357 Composite BSI structure and method of manufacturing the same Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Jhy-Jyi Sze +3 more 2023-10-17