Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837663 | Via structure with low resistivity and method for forming the same | Fu-Hsiang Su, Ke-Jing Yu, Chih-Hong Hwang, Jyh-Huei Chen | 2023-12-05 |
| 11784218 | Gate air spacer protection during source/drain via hole etching | Jyh-Huei Chen | 2023-10-10 |
| 11728216 | Semiconductor device with reduced contact resistance and methods of forming the same | Jhy-Huei Chen | 2023-08-15 |
| 11626495 | Protective liner for source/drain contact to prevent electrical bridging while minimizing resistance | Hsin-Huang Lin, Jyh-Huei Chen | 2023-04-11 |
| 11545432 | Semiconductor device with source and drain vias having different sizes | Yi-Ju Chen, Jyh-Huei Chen | 2023-01-03 |