Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837663 | Via structure with low resistivity and method for forming the same | Kuo-Chiang Tsai, Fu-Hsiang Su, Ke-Jing Yu, Jyh-Huei Chen | 2023-12-05 |
CH
Chih-Hong Hwang
Overall (2023): #489,942 of 537,848Top 95%
1
Patents 2023