Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837663 | Via structure with low resistivity and method for forming the same | Kuo-Chiang Tsai, Ke-Jing Yu, Chih-Hong Hwang, Jyh-Huei Chen | 2023-12-05 |
| 11658215 | Method of forming contact structures | Yi-Hsien Chen | 2023-05-23 |