Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11681851 | Hierarchical density uniformization for semiconductor feature surface planarization | Venkata Sripathi Sasanka Pratapa, Wen-Hao Cheng | 2023-06-20 |
| 11669957 | Semiconductor wafer measurement method and system | Peng Chen, Yi-An Huang, Wei-Chung Hu, Wen-Hao Cheng, Shiang-Bau Wang +1 more | 2023-06-06 |
| 11600505 | Systems and methods for systematic physical failure analysis (PFA) fault localization | Peng Chen, Wen-Hao Cheng, Chien-Hui Chen | 2023-03-07 |