Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756924 | Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer | Hong-Wei Chan, Yung-Shih Cheng, Yao-Te Huang, Hui Yu Lee | 2023-09-12 |
| 11551968 | Inter-wire cavity for low capacitance | Hsiu-Wen Hsueh, Chii-Ping Chen, Po-Hsiang Huang, Chang-Wen Chen, Cai-Ling Wu | 2023-01-10 |