Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764143 | Increasing contact areas of contacts for MIM capacitors | Yao-Te Huang | 2023-09-19 |
| 11756924 | Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer | Hong-Wei Chan, Jiing-Feng Yang, Yao-Te Huang, Hui Yu Lee | 2023-09-12 |