Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11772960 | Method of forming dielectric and metal sealing layers on capping structure of a MEMs device | Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Jung-Kuo Tu | 2023-10-03 |
HL
Hung-Wei Liang
Overall (2023): #419,572 of 537,848Top 80%
1
Patents 2023