HL

Hu-Wei Lin

TSMC: 1 patents #2,163 of 4,064Top 55%
Overall (2023): #419,550 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11562968 Apparatus for lithographically forming wafer identification marks and alignment marks Chih-Hsien Hsu, Yu-Wei Chiu, Hai-Yin Chen, Ying-Hao Wang, Yu-Hen Wu 2023-01-24