GL

Geng-He Lin

TSMC: 1 patents #2,163 of 4,064Top 55%
Overall (2023): #440,004 of 537,848Top 85%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11776948 Integrated circuit filler and method thereof Tseng Chin Lo, Molly Chang, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li +1 more 2023-10-03