Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776948 | Integrated circuit filler and method thereof | Tseng Chin Lo, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2023-10-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776948 | Integrated circuit filler and method thereof | Tseng Chin Lo, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang +1 more | 2023-10-03 |