Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776948 | Integrated circuit filler and method thereof | Tseng Chin Lo, Molly Chang, Ya-Wen Tseng, Zi-Kuan Li, Bo-Sen Chang +1 more | 2023-10-03 |
| 11762302 | Integrated circuit overlay test patterns and method thereof | Tseng Chin Lo, Bo-Sen Chang, Yueh-Yi Chen, Ying-Jung Chen, Kung-Cheng Lin +1 more | 2023-09-19 |