Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856864 | Sub 60nm etchless MRAM devices by ion beam etching fabricated T-shaped bottom electrode | Yi Yang, Yu-Jen Wang | 2023-12-26 |
| 11818961 | Self-aligned encapsulation hard mask to separate physically under-etched MTJ cells to reduce conductive re-deposition | Yi Yang, Vignesh Sundar, Yu-Jen Wang | 2023-11-14 |
| 11800811 | MTJ CD variation by HM trimming | Yi Yang, Jesmin Haq, Yu-Jen Wang | 2023-10-24 |
| 11785863 | Under-cut via electrode for sub 60nm etchless MRAM devices by decoupling the via etch process | Yi Yang, Yu-Jen Wang | 2023-10-10 |
| 11696511 | Low resistance MgO capping layer for perpendicularly magnetized magnetic tunnel junctions | Sahil Patel, Guenole Jan, Ru-Ying Tong, Vignesh Sundar, Yu-Jen Wang +2 more | 2023-07-04 |
| 11631802 | Etching and encapsulation scheme for magnetic tunnel junction fabrication | Vignesh Sundar, Yi Yang, Zhongjian Teng, Jesmin Haq, Sahil Patel +2 more | 2023-04-18 |
| 11563171 | Highly physical ion resistive spacer to define chemical damage free sub 60 nm MRAM devices | Yi Yang, Yu-Jen Wang | 2023-01-24 |