Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856864 | Sub 60nm etchless MRAM devices by ion beam etching fabricated T-shaped bottom electrode | Dongna Shen, Yu-Jen Wang | 2023-12-26 |
| 11818961 | Self-aligned encapsulation hard mask to separate physically under-etched MTJ cells to reduce conductive re-deposition | Dongna Shen, Vignesh Sundar, Yu-Jen Wang | 2023-11-14 |
| 11800811 | MTJ CD variation by HM trimming | Dongna Shen, Jesmin Haq, Yu-Jen Wang | 2023-10-24 |
| 11785863 | Under-cut via electrode for sub 60nm etchless MRAM devices by decoupling the via etch process | Dongna Shen, Yu-Jen Wang | 2023-10-10 |
| 11723281 | Metal/dielectric/metal hybrid hard mask to define ultra-large height top electrode for sub 60nm MRAM devices | Yu-Jen Wang | 2023-08-08 |
| 11631802 | Etching and encapsulation scheme for magnetic tunnel junction fabrication | Vignesh Sundar, Dongna Shen, Zhongjian Teng, Jesmin Haq, Sahil Patel +2 more | 2023-04-18 |
| 11563171 | Highly physical ion resistive spacer to define chemical damage free sub 60 nm MRAM devices | Dongna Shen, Yu-Jen Wang | 2023-01-24 |
| 11545622 | CMP stop layer and sacrifice layer for high yield small size MRAM devices | Zhongjian Teng, Yu-Jen Wang | 2023-01-03 |