Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11551966 | Method of forming semiconductor structure having layer with re-entrant profile | Yi-Shan Chen, Li-Te Lin, Pinyen Lin | 2023-01-10 |
CY
Chan Syun David Yang
Overall (2023): #482,405 of 537,848Top 90%
1
Patents 2023