Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854949 | Package structure having a plurality of chips attached to a lead frame by redistribution layer | Danfeng Yang, Shuo Liu, CHENYE HE | 2023-12-26 |
| 11688612 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Reza A. Pagaila, Jun Mo Koo, HeeJo Chi | 2023-06-27 |
| 11569136 | Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP | Kang Chen | 2023-01-31 |