Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854949 | Package structure having a plurality of chips attached to a lead frame by redistribution layer | Yaojian Lin, Danfeng Yang, CHENYE HE | 2023-12-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854949 | Package structure having a plurality of chips attached to a lead frame by redistribution layer | Yaojian Lin, Danfeng Yang, CHENYE HE | 2023-12-26 |