Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688612 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Yaojian Lin, Jun Mo Koo, HeeJo Chi | 2023-06-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688612 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Yaojian Lin, Jun Mo Koo, HeeJo Chi | 2023-06-27 |