Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823973 | Package with compartmentalized lid for heat spreader and EMI shield | DongSam Park, Woojin Lee | 2023-11-21 |
| 11817357 | Region-of-interest positioning for laser-assisted bonding | Wagno Alves Braganca, JR. | 2023-11-14 |
| 11688718 | Semiconductor device and method of controlling warpage during LAB | Wagno Alves Braganca, JR. | 2023-06-27 |
| 11670563 | Thermally enhanced FCBGA package | Wagno Alves Braganca, JR., DongSam Park | 2023-06-06 |