Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817357 | Region-of-interest positioning for laser-assisted bonding | KyungOe Kim | 2023-11-14 |
| 11688718 | Semiconductor device and method of controlling warpage during LAB | KyungOe Kim | 2023-06-27 |
| 11670563 | Thermally enhanced FCBGA package | KyungOe Kim, DongSam Park | 2023-06-06 |